Description
ALPHA OM-338-PT is a lead-free, no-clean solder paste designed for a wide range of applications, offering performance comparable to tin-lead processes. It provides excellent print capabilities, fine feature repeatability, and high-throughput performance. The paste delivers outstanding reflow results, with strong soldering on CuOSP, excellent resistance to solder balls, and reliable joint cosmetics. ALPHA OM-338-PT ensures improved in-circuit test yields, long-term reliability, and meets IPC-7095 Class 3 and ROL0 classifications for voiding.
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